MID

MID, short for "Molded Interconnect Devices", represents a fascinating technology in the field of electronics manufacturing. This method involves the production of circuit carriers that are not only two-dimensional but can also take on three-dimensional shapes.

The process uses injection moulding to integrate electrically conductive structures directly into the substrate. This creates complex and compact components that traditional circuit carriers often cannot achieve. MID thus revolutionises not only the design of electronic components but also their functionality and adaptability to various applications.