LDS

LDS, short for Laser Direct Structuring, is a highly precise manufacturing process used in the production of MID (Molded Interconnect Devices). In this process, a laser is used to activate and structure specific areas of a component.

This creates a permanent, highly precise three-dimensional structure on the surface of the component. This structure enables the integration of conductor tracks, contacts and other electronic functions directly into the component, without the need for additional layers or components.